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Idem, Nitrogen Atmosphere Soldering, Circuits Assembly, January 1991 7 Bernier, D, The Effects of Metallic Impurities on the Wetting Properties of Solder, Proceedings of the First Printed Circuit World Convention, Uxbridge, UK, Vol 2, 1978, 25 15 8 Hallmark, C, Langston, K, and Tulkoff, C, Double Reflow: Degrading Fine Pitch Joints in the Soldering Process, Technical Proceedings of NEPCON West, 1994, pp 695 705 9 Kear, F W, The Dynamics of Joint Formation, Circuits Assembly, October 1992, pp 38 41 10 Manko, H, Solders and Soldering, 2nd ed, McGraw-Hill, 1979 11 Wassink, R J K, Soldering in Electronics, Electrochemical Publications, Ltd, 1984 12 Hutchins, C L, Soldering Surface Mount Assemblies, Electronic Packaging and Production, Supplement, August 1992, pp 47 53 13 Hartmann, M, et al, Experimental Investigations of Laser Microsoldering, SPIE, Vol.

1598, Lasers in Microelectronics Manufacturing, 1991, pp 175 185 14 Spletter, P J, and Goruganthu, R R, Bonding Metal Electrical Members with a Frequency Doubled Pulsed Laser Beam, US Patent No 5,083,007, January 1992 15 Freedman, G, Atmospheric Pressure Gaseous Flux-Assisted Laser Reflow Soldering, US Patent No 5,227,604, July 1993 16 Charschan, S, Lasers in Industry, Laser Institute of America, 1972, p 116 17 Hecht, J, Understanding LASERs, Howard W Sams, 1988 18 Ready, J F, Industrial Applications of LASERs, Academic Press, 1978 19 Burns, F, and Zyetz, C, Laser Microsoldering, Electronic Packaging and Production, May 1981, pp 109 120 20 Chang, D U, Analytical Investigation of Thick Film Ignition Module by Laser Soldering, Proceedings of ICALEO 85, 1985, pp 27 38 21 Hartmann, M, et al, Experimental Investigations of Laser Microsoldering, SPIE, Vol.

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level and quality, tyre pressure, brake oil pressure, transmission fluid and fuel pressure are monitored by the various microsystems MEMS components in the automotive industry are required to go through stringent testing These devices are tested for their endurance as they are expected to perform in harsh environmental conditions

1598, Lasers in Microelectronics Manufacturing, 1991, pp 175 185 22 Hernandez, S, Wire Bonding with CO2 Lasers, Surface Mount Technology, March 1990, pp 23 26 23 Wright, E, Laser vs Vapor Phase Soldering, Proceedings of the 30th Annual SAMPE Symposium, March 1985, pp 194 201 24 Lish, E F, Laser Attachment of Surface Mounted Components to Printed Wiring Boards, paper presented at the Sixth Annual Soldering Technology Seminar, Naval Weapons Center, China Lakes, CA, February 1982 25 Waller, D, Colella, L, and Pacheco, R, et al, Thermode Structure Having and Elongated, Thermally Stable Blade, US Patent No 5,229,575, July 20, 1993 26 Wilkins, J A, Heat Transfer Control for Hot-Bar Soldering, Proceedings of Surface Mount International, 1993, pp 186 192..

27. Gunkel, R., Solder Aluminum Joints Ultrasonically, Welding Design and Fabrication, Vol. 52, No. 9, September 1979, pp. 90 92. 28. Shuster, J. L., and Chilko, R. J., Ultrasonic Soldering of Aluminum Heat Exchangers (Air Conditioning Coils), Welding Journal (U.S.), Vol. 54, No. 10, October 1975, pp. 711 717. 29. Hosking, F. M., Frear, D. R., Vianco, P. T., and Keicher, D. M., Sandia National Labs Initiatives in Electronic Fluxless Soldering, Proceedings of the 1st International Congress on Environmentally Conscious Manufacturing, Santa Fe, September 18, 1991. 30. Vianco, P.T., Rejent, J.A., and Hosking, F. M., Applications-Oriented Studies in Ultrasonic Soldering, Proceedings of the American Welding Society Convention and Annual Meeting, Cleveland, 1993. 31. Antonevich, J. N., Fundamentals of Ultrasonic Soldering, American Welding Society, 4th International Soldering Conference, Welding Journal Research Supplement, Vol. 55, July 1976, pp. 200-s to 207-s. 32. Shoh, A., Industrial Applications of Ultrasound, IEEE Transactions on Sonics and Ultrasonics, Vol. SU-22, March 1975, pp. 60 71.

As printed circuit assemblies (PCAs) become more densely populated, the probability of rework increases. So does the complexity of rework steps. Rework deserves consideration both in terms of board design as well as in conducting the repair. Deep preheating cycles, careful thermal profiling, and thermal masking of adjacent components become critical. PCAs are often mix-mount (surface-mount technology [SMT] and plated through-hole [PTH]). Additionally, they may contain press-fit components or other subassemblies that may be sensitive to overheating. Aside from hand repair with a soldering iron, there are two techniques that are the mainstays of repair: solder fountain and hot-gas. The former is a variant of wave soldering and is tailored to removal or post-soldering addition of PTH (solder-tail) components. Hot-gas (also known as hot-air) soldering is used primarily for removal and replacement of SMT components. Because repair of dense assemblies is difficult, this chapter covers some additional descriptions and tips for repair. The onset of Pb-free soldering has increased the difficulty of repair processes due to generally higher melting temperatures and slower wetting times that are characteristic of the most prevalent Pb-free solders. Otherwise, repair involving Pb-containing solders and Pb-free solders is the same.

(MSB)

This technique consists of directing a heated stream of air or other process gas such as nitrogen at the component to be removed. Modern hot-gas repair stations are sophisticated, with computer control, predictive reflow profiling, vision systems to assist in component alignment to bonding pads on the printed wiring board (PWB), preheating stations, and accommodations for component removal. Hot-gas repair is most often used for SMT components but can be adapted for PTH component removal.

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