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Specification 55 C to +125 C + 5 V ( 5%) 50 g +18 V +18 V ( 12 V) at 50 g +025 V to +475 V 5% of full scale 05% of full scale Dc to 1 kHz 024% of full scale 048% of full scale 2% 2000 g

FIGURE 15.2 The method of mounting PBAs contributes to shock and vibration concerns, but can be reduced by good design practices.

15.6.2.5 Board Deflection. The amount of strain on a PBA component is a function of the maximum deflection of the PBA when subjected to shock and vibration. Those components mounted closest to the center of the assembly are subjected to the greatest strain, as illustrated in Fig. 15.3. A set of empirical maximum deflection (d) calculations has been developed by Steinberg, and his latest equation7 has more parameters than previous equations, reflecting the sophistication and requirements for modern PBDs (units adjusted from inches to mm). d= k 0.00022 B ct L (15.3)

FIGURE 15.3 The PB bends in a PBA during shock and vibration, with the most severe stresses applied to the components mounted centermost on the assembly.

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k = units conversion coefficient; for inches k = 1, for mm, k = 25.4 B = length of PB edge parallel to component located at center of board (worst case), mm L = length of component, mm t = thickness of PB, mm c = 1.0 for standard DIP = 1.26 for DIP with side brazed leads = 1.0 for PGA with four rows of pins (one row extending along the perimeter of each edge) = 2.25 for CLCC

Temperature range Power supply Measurement range Preamp zero-g output level Preamp output span Uncommitted amp output range Overall accuracy Linearity Bandwidth Voltage noise (p p) At BW = 03 kHz At BW = 10 kHz Transverse sensitivity Unpowered shock survival

Analysis of the maximum deflection calculation formula reveals (as expected) that components with some compliance built into their component mounting and electrical terminations (such as the DIP and PGA) can be subjected to about twice the vibrational deflection as an SMT CLCC, provided component size, PB size, and PB thickness are equivalent. The latest equation for maximum deflection calculations is rated for 10 million stress reversals when subjected to harmonic (sinusoidal) vibration, and 20 million stress reversals when subjected to random vibration. It must be understood that this equation is a first approximation for predicting solder joint life. There are many factors that must be included for a more rigorous analysis and prediction. A more thorough discussion is found in Barker.6 15.6.2.6 Natural (Fundamental) Resonance of Printed Board Assemblies. The mechanical mounting of PBAs and their components is a key design consideration in the ability of the PBA to withstand shock and vibration. The overall size of the PBA is not a major factor, provided a suitable mechanical support structure is included as a part of the PBA s product definition requirements. There is a large matrix of ways to mount panels (PBAs) using various combinations of free edges, supported edges, fixed edges, and point supports and by calculating fundamental resonance. The following four examples compare the fundamental natural resonances of the same rectangularly shaped PBA using different edge-mounting techniques. Additional formulas for calculating other natural resonances are found in Barker,6 Steinberg,7 and others. In the following examples demonstrations of the sensitivity of PBAs to their methods of mounting the same PBA is used for direct comparative purposes (see Fig. 15.4). The following are the design requirements and material parameters that were used for the calculations:

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1 IPC/JEDEC J-STD-033, Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 2 Freedman, G M, Patel, K B, Batchelder, R G, Method and Process for Soldering Reflow-Compatible Plated Through-Hole Components into Printed Wiring Board in Order to Circumvent the Wave Soldering Process (Buried Intrusive Reflow Soldering and Rework), Research Disclosure, May 2006, pp 543 545 3 Freedman, G M, Baldwin, E A, Method and Material for Maintaining Cleanliness of High Density Circuits during Assembly, Proceedings of the SMTA Pan-Pacific Conference, February 2003 4 Iman, R, et al, Evaluation of a No-Clean Soldering Process Designed to Eliminate the Use of Ozone Depleting Chemicals, IWRP CRADA No CR91-1026, Sandia National Laboratories, 1991 5 Hartman, H H, Soft Soldering under Cover Gas: A Contribution to Environmental Protection, Elektr Prod Und Prftechnik, H4, 1989, pp 37 39 6.

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