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Solder can be applied to the board as a paste, solid pre-form, or solder-coated pad. In all cases, the component must be held down during the soldering process to ensure contact of component leads with bonding pads. Proper gas pressure, temperature, nozzle translation speed, and flux are required to effect joint formation. Otherwise, the same reflow considerations are required for this technique as for any other. Heating ramp rate, solder paste preheating, peak temperature, liquidus duration, etc., must be observed for successful joint formation and joint reliability considerations. A thermocouple-instrumented profile board populated with components is needed to determine the proper soldering profile. Adding thermocouples to adjacent solder joints is recommended to ensure that the soldering profile will not inadvertently re-reflow neighboring components.

130 Slave Address Byte Command Byte Output Data Byte SDA MSB LSB ACK MSB LSB ACK MSB LSB ACK SCL 1 2 3 7 8 9 1 2 8 9 1 2 8 9 Start Condition Stop Condition

This method relies on a heated, ultrasonically vibrated soldering tip that simultaneously melts and agitates the solder (Fig. 47.42). The ultrasonic energy is transferred from the soldering tip through the molten solder droplet beneath it and ultimately to the component lead and circuit

FIGURE 47.42 The ultrasonic soldering iron is composed of four main components: an ultrasonic transducer; a horn for concentrating and directing ultrasonic energy; a resistance heater; and the soldering tip, which emits both thermal and ultrasonic energy.

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board pad The high-energy agitation of the solder droplet helps to cleanse bond-inhibiting materials from the solder and solder-metal interfaces (component lead and bonding pad) If soldering temperature is appropriate, any exposed solderable metal surfaces are rendered wettable by this technique Ultrasonic soldering precludes the need for chemical fluxing agents Aluminum and other difficult-to-join metals can be soldered by this method The viability of this technique has been well proven on a commercial scale in the manufacture of air-conditioner heat exchangers27, 28 Ultrasonic soldering has also been applied as a batch or continuous mass reflow process In these instances, the molten solder is ultrasonically agitated while the assembly to be soldered is immersed in it Similar arrangements have been made for ultrasonically vibrating the part while dipping it in a molten bath or wave of solder These mass processes are more common for non-electronic assembly.

Accelerometer specifications [8]

Care must be taken in ultrasonic soldering to tune the tip amplitude and/or frequency to the mass of the system being soldered Overagitation results in excessive cavitation and splashing of the liquid solder This generates solder balls, which could short finer-spaced leads or pads Additionally, ultrasonic agitation increases the dissolution rate of any soluble metals into the solder at any given temperature, which may degrade solder-joint strength This technique can be useful for the repair of opens or the installation of new or changeorder components onto completed circuit assemblies Because no flux is required, a previously cleaned board will stay clean through repair or upgrading operations This technique is applicable to all peripherally leaded surface-mount components that are not susceptible to ultrasonic energy damage It can also accommodate through-hole device soldering Equipment availability is limited, with only a few manufacturers worldwide.

Several past and recent publications provide a comprehensive review of this technology s applicability and attributes29, 30, 31, 32.

Fatigue life modeling for PBA mounted components has become significantly more complex due to in-use simultaneous application of both vibration and thermal cycles. Vibration strains and thermal strains should be superposed for more representative modeling.

Figure 6.26 Communication format for MAX521 serial DAC. All transmission begins with a START condition and ends with a STOP condition.

15.6.2.4 Types of Edge Mounting. The problems, methods of analysis, and minimization of the effects of shock and vibration on PBAs are the same as in other engineering applications, and similar solutions can be used. PBAs are designed and manufactured in a wide range of shapes and sizes, with rectangular being the most common because of the shape of most electrical/electronic equipment, especially for plug-in PBAs. Though PBAs are a multidegree-of-freedom system, the fundamental mode is of primary importance because it has the large displacements that are the primary cause of fatigue failure in solder joints, component leads, wires, and connector contacts.6 Most vibrational fatigue damage occurs at the fundamental or natural frequency because displacement is highest and stress is maximized. Edge or boundary conditions are terms that are used to define the method of attachment of the PBA (or, more generically, a panel) to its mounting frame.The term free edge is used to define those edges that are not restrained and are free to move and/or rotate along the edge of the PBA out of their normal mounting plane. The terms supported edge or simple support used to define an edge that is restrained in out-of-plane movements but is allowed rotational movement around the PBA s edge. The terms fixed edge or clamped edge are used to define an edge that is restrained in both out-of-plane and rotational movements. Illustrations of the definitions for fixed edge, supported edge, and free edge, and their applications to plug-in mounted PBAs, are shown in Fig. 15.2.

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